- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: AgPtPd
- Application: Hybrid IC
- Description: C4081D is a Ag/Pd/Pt formulation which provides outstanding leach resistance and aged adhesion with many types of solder. This material has excellent silver migration resistance. C4081D prints and hold 5 mil lines
and spaces. It's exceptional coverage makes C4081D cost effective to use.
- Key features: Excellent Ag migration resistance#High coverage#Outstanding leach resistance
- Process Temperature: 850°C peak temperature. Dwell time of 9-11 minutes.
- Film Thickness : 7-1+U370 um
- Viscosity: 310-340 Kcps, Brookfield HBT,
spindle #6 @ 10 rpm, 25 °C
- Conductivity: ≤ 187 milliohms per square
at 8.5 microns fired film thickness
- Solids: 71.1 ±1%
