- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: AgPd
- Application: Hybrid IC
- Description: C2129A is a high performance mixed bonded Ag/Pd conductor material. It offers cost savings over standard Ag/Pd formulations while maintaining the advantages of leach resistance and aged adhesion. C2129A is also aluminum wire bondable. C2129A is supplied with a rheology, which results in a dense, uniform fired film.
- Key features: Low cost#Excellent solderability and leach resistance#Low resistivity#Good Al wire bond adhesion (initial and aged)
- Process Temperature: 850 °C peak temperature. Dwell time at peak temperature for 10 minutes.
- Film Thickness : 10-15 um
- Viscosity: 120-180 Kcps Brookfield HBTSC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
- Conductivity: ≤ 6.0 milliohms/square at 12 um fired film thickness
- Solids: 80.0 ± 1.0 %
- Alloy Ratio: 30:01:00
