- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: AgPd
- Application: Hybrid IC
- Description: C2105 is a 20:1 AgPd composition designed for hybrid applications and application where leach resistance is required. The C2105 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial applications where common requirement exist. It exhibits good solderability and aged adhesion properties.
- Key features: Good solderability#Excellent long-term adhesion#Good leach resistance
- Process Temperature: 850 °C peak temperature10 minutes at peakTotal cycle time 30-60 minutes.
- Film Thickness : 9-15 um
- Viscosity: 150-220 Kcps Brookfield HBTSC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
- Conductivity: ≤ 8 milliohms/square at 12 um fired film thickness
- Solids: 79.0% ± 1.5 %
- Alloy Ratio: 20:01
