3571

  • Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Berryllium Oxide
  • Metal: Ag
  • Application: Hybrid IC
  • Description: 3571 is a high performance silver conductor designed for cost sensitive hybrid applications. 3571 employs advanced powders technology with a mix bonded frit system to yield a highly dense fired film that is resistant to solder leaching. 3571 also exhibits excellent adhesion to Beryllium Oxide (BeO) substrates.
  • Key features: Dense fired film#Designed for cost sensitive hybrid applications#Exhibits excellent adhesion to beryllium oxide substrates
  • Process Temperature: 850°C peak temperature. Dwell time of 5-10 minutes at peak. Firing range of 850°C to 925°C possible with minimal differences in properties.
  • Film Thickness : 9 -15 um
  • Viscosity: 170-200 kcps, Brookfield HBT, SC4-14 spindle and 6R utility cup at 10 rpm, 25°C
  • Conductivity: ≤ 1.5 milliohms/square at 25 microns fired film thickness
  • Alloy Ratio: 100
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