Heraeus Electronics' Microbond® SMT660 Series is innovating the automotive industry's approach to highly reliable and cost-effective solder alloys. This solution empowers manufacturers with the ability to maintain a competitive Total-Cost-of-Ownership (TCO) while satisfying emerging industry requirements.
The Microbond® SMT660 flux, in combination with different alloys, delivers exceptional performance and reliability, further solidifying Heraeus’ commitment to innovating bonding materials in the automotive electronics landscape.
The Microbond SMT660 Series offers exceptional reflow performance, standing out for its excellence in the reflow process without the need for additional nitrogen (N2). This feature effectively minimizes defect rates and contributes to a reduced Total-Cost-of-Ownership (TCO) for manufacturers. Heraeus Electronics' innovation aligns seamlessly with the industry's quest for reliability and cost-efficiency, making the Microbond SMT660 an indispensable asset for the automotive sector.
The GLOBAL Technology Awards, established in 2005, have become an industry benchmark, celebrating exceptional standards and groundbreaking solutions within the global SMT and advanced packaging industry. The award recognizes companies and individuals who consistently drive the industry forward with their outstanding innovations.
Heraeus Electronics remains at the forefront of innovation, continually pushing boundaries and introducing solutions that empower manufacturers to thrive in a dynamic and evolving market.
