Heraeus Electronics' Microbond® SMT660 Innolot® 2.0 solder alloy is innovating the automotive industry's approach to highly reliable and cost-effective solder alloys. This solution empowers manufacturers with the ability to maintain a competitive Total-Cost-of-Ownership (TCO) while satisfying emerging industry requirements.
"The Mexico Technology Award is a testament to Heraeus Electronics' dedication to driving innovation and excellence in the automotive industry," stated Manu Vaidya, Global Product Manager at Heraeus Electronics. "Our Microbond® SMT660 Flux in combination with either the well-known Innolot® or the new Innolot® 2.0 alloy delivers exceptional performance and reliability, further solidifying our commitment to innovating bonding materials in the automotive electronics landscape."
At the core of Heraeus Electronics' victory is the Microbond® SMT660 Series remarkable high creep resistance. This feature translates to extended product life cycles even when subjected to higher operating temperatures.
One of the standout features of the Microbond® SMT660 Solder Paste Series is its exceptional reflow performance. Notably, this solder paste excels in the reflow process without the need for additional nitrogen (N2), effectively minimizing defect rates and contributing to a reduced Total-Cost-of-Ownership (TCO) for manufacturers.
The Mexico Technology Awards acknowledge the latest innovations available in Mexico produced by OEM manufacturing equipment and materials suppliers during the last 12 months. For more information, visit 2024 Mexico Technology Awards Accepting Entries – Mexico EMS.
Heraeus Electronics remains at the forefront of innovation, continually pushing boundaries and introducing solutions that empower manufacturers to thrive in a dynamic and evolving market.
