Sintering is a die interconnection method that is becoming more common in power electronics applications thanks to its ability to increase reliability and decrease thermal resistance of the die attach.
It can now also be used as a replacement of traditional Al wire bond connections to the topside source pads of the die when used with solutions like Heraeus Electronics’ Die Top System (DTS®).
Sintering requires unique processes that can include elevated temperature, pressure and time variables that impact the strength of the attachment accordingly. This application note will cover requirements from the die for sintering and sintering process details when using Heraeus’ silver sinter paste and DTS®.
