- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: AgPd
- Application: Hybrid IC
- Description: C4003 is a 3/1 Ag/Pd thick film conductor material that isboth solderable and heavy gauge aluminum wirebondable. This product was developed for use in harsh environments, such as under-the-hood automotiveapplications.
- Key features: Excellent solderability#High aged adhesion#Good AI wire bond adhesion (initial and aged)#Good thermal cycled and autoclave adhesion
- Process Temperature: Fire at 850 °C peak temperature 10 minutes at peak temperature. Dwell time of 10 minutes at peak.
- Film Thickness : 10-14 um
- Viscosity: 150-200 Kcps, Brookfield HBTSC4-14 spindle and 6R cup at 10 rpm, 25 °C
- Conductivity: ≤ 25 milliohms/square at 12 um fired film thickness
- Solids: 82.2 ± 1 %
- Alloy Ratio: 03:01
