C2290P

  • Paste Type: Conductor
  • Application Method: Stencil Printing
  • Substrate: Alumina
  • Metal: AgPd
  • Application: FLS/Potentiometers
  • Description: C 2290P is a screen or stencil printable, silver palladium 9:1 paste designed as a hole plug in alumina substrates. The high solids loading allows excellent filling properties. C 2290P has low shrinkage, which allows a complete fill of the through hole.
  • Key features: High solids loading#Low shrinkage#For use in a print process
  • Process Temperature: Fire at 850 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30-60 minutes.
  • Viscosity: 15-25 Pas (25 °C, D = 100/s)
  • Conductivity: ≤ 7-15 milliohms/square at 40um fired film thickness
  • Solids: 91.0 ± 1.0 %
  • Alloy Ratio: 09:01
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