- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: AgPd
- Application: Hybrid IC
- Description: C2130 is a Pd/Ag composition designed for applications where more leach resistance is required. The C2130 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial circuits where more stringent requirements exist. It exhibits excellent solderability, aged adhesion properties and is aluminium wire bondable.
- Key features: Excellent solderability and leach resistance#Excellent long term adhesion#Good AI wire bond adhesion (initial and aged)
- Process Temperature: 850 °C peak temperature. 10 minutes at peak. Total cycle time 30-60 minutes.
- Film Thickness : 10-15 um
- Viscosity: 150-220 Kcps Brookfield HBT
SC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
- Conductivity: ≤ 35 milliohms/square at 12 um fired film thickness
- Solids: 79.0 ± 1.0 %
- Alloy Ratio: 03:01
