- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Berryllium Oxide
- Metal: Ag
- Application: Hybrid IC
- Description: 3571 is a high performance silver conductor designed for cost sensitive hybrid applications. 3571 employs advanced powders technology with a mix bonded frit system to yield a highly dense fired film that is resistant to solder leaching. 3571 also exhibits excellent adhesion to Beryllium Oxide (BeO) substrates.
- Key features: Dense fired film#Designed for cost sensitive hybrid applications#Exhibits excellent adhesion to beryllium oxide substrates
- Process Temperature: 850°C peak temperature.
Dwell time of 5-10 minutes at peak.
Firing range of 850°C to 925°C possible with minimal differences in properties.
- Film Thickness : 9 -15 um
- Viscosity: 170-200 kcps, Brookfield HBT, SC4-14 spindle and
6R utility cup at 10 rpm, 25°C
- Conductivity: ≤ 1.5 milliohms/square at 25 microns fired film
thickness
- Alloy Ratio: 100
