Surface Mount Technology Solder Pastes

Microbond® SMT660 Innolot® No-Clean Printing T4 Solder Paste

With our new approach through Microbond® SMT660 Innolot® for a high-reliable solder alloy for demanding applications, we are showing how to keep competitive Total-Cost-of-Ownership, while fulfilling emerging requirements. The next generation of Innolot® solder paste offers the well known features of higher creep resistance, resulting in longer product life cycles at higher operating temperatures. The SMT660 Innolot® solder paste performs in the air without additional N2 during reflow, while keeping defects low, reducing your TCO. This specifically means reduced pin and blowhole defects, very low BGA voiding and low area voiding. 
Heraeus Electronics offers on top the new SMT660 Innolot® 2.0 with reduced cost, while keeping the features of Innolot®.

 

Microbond® SMT712: Excellent General Purpose Solder Paste 

Heraeus Electronics Microbond® SMT712 is designed to meet all the needs of demanding SMT applications. With a wide process window, and excellent high-speed printing and wetting properties, keeping head-in-pillow defects to the minimum during the soldering process.

 

High Reliablity Solder Solutions

Innolot provides reliability improvements for applications using both standard operating temperatures and elevated ones. Operating temperatures of up to 150 °C are possible. Innolot with its improved creep strength enables to accommodate the CTE mismatches.

HT1 is a further lead-free solder alloy that provides high reliability in applications using ceramic substrates or direct bonded copper (DBC). 

 

Applications include:

• Engine Control Unit (ECU)
• ADAS (Radar, Lidar, Sensors, DCU)
• Transmission controllers
• Braking (ABS)
• Steering and stability systems (ABS, ESP)
• LED
• Servers and systems
• Smartphones