Mini LED Solder Pastes and Fluxes
Welco LED-series fine pitch solder paste & fluxes for soldering of Mini LEDs
State-of-the-art Mini LEDs with minimal size
Enables maximum yield with zero defects, thermal warpage control and high reliability performance
Pioneers carbon reduction with Welco 100% recycled tin pastes
No-Clean Ultra-Fine Pitch Printing Paste
LED120 T7 & LED131 T6 Welco® paste
- State-of-the art T6 & T7 Welco powders with perfectly spherical, smooth surface and narrow particle size distribution
- Consistent paste release down to 70um stencil openings, minimal void after multiple reflows
- Enables defect free soldering of Mini LED to substrates: no splashing, minimal void, no die fly, minimal die rotation
- In mass production for years for Mini LED (eg. 4X6 mil) applications including indoor & outdoor displays, and TV & tablet backlights
- Extendable to T8+ and finer pitch for future generations
- Available in SAC305, 100% recyled tin SAC305, and other alloys
LED140 Flux
- No clean flux with high tackiness, suitable for Mini LED high-speed mass transfer & assembly processes
- Enables defect free soldering of Mini LED to substrates-minimal void, no die missing or die fly, minimal die rotation
- Excellent wetting and transparent residue after soldering
Low Temperature Fine Pitch Printing Paste
Welco™ AP519 T6 no clean printing paste
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Low peak reflow temperature down to 170°C which minimizes warpage and prevents solder-remelt
- Targeting Mini LED applications that require multiple reflows at low temperature
- Excellent paste release down to 150um pitch, minimal defects such as void or beading
- In mass production for popular consumer applications
Applications include:
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Mini LED backlight TVs and tablets
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Mini LED display - outdoor signage or indoor large screens
