Power Electronic Module Die Attach Solder Pastes

Heraeus Electronics’ Microbond® PE830 solder paste is designed for use of die attach in power electronics. The revolutionary flux system incorporates synthetic resins that eliminate batch-to-batch variances and allows supply chain stability. As a result, total cost of ownership (TCO) can be reduced through constantly high yield of sub-assemblies. These are realized by outstanding low void performance, low splashing rate as well as low die tilt and rotation.

For power electronic modules, the attachment of bare dies to a ceramic substrate is a key process. It is complex with many influencing factors, like oven profile, soldering atmosphere, various die sizes and metallizations. Due to subsequent processes like bonding and baseplate attachment, this process needs to be well controlled and precise. Solder splashing, tilting or shifting of dies can lead to failures at subsequent processes and ultimately to yield loss of costly sub-assemblies.

Heraeus Electronics developed a new flux system, which is based completely on fully synthetic resins denying natural variances and therefore minimizing batch-to-batch variations. On top, it shows best-in-class performance for voiding, splashing, tilt and shift. With synthetic resin being well controlled, there is low ionic contamination. The clear and colorless residues can be cleaned with standard cleaners and without discoloration of the substrate.