Solder Pastes for Power Discrete
Available in syringe and jar packaging
Multiple lead-containing high-melting point alloys suiting to different device needs
Halogen Zero and Halogen-Free formulation
Long worklife suitable for high volume production environment
Low voiding performance
Minimum splashing
Easy flux cleaning
Proven reliability for die and clip attachment
Solvent Clean High-Lead Dispensing Solder Paste
Microbond® DA5118 D is a solvent-clean high-lead die and clip attach solder paste suitable for high reliability power packages. Designed for exceptional dispensing capability in automated high-volume production systems, it meets demanding voids, wetting and cleanliness requirements.
- Consistent dispensability
- Precise dispense volume
- Wide reflow window
- Superior wetting with low flux residue
- Consistent low voids rates
- Excellent cleanability
- Long work life
Solvent Clean High-Lead Printing Solder Paste
Microbond® DA5118 P is a printing solvent clean high-lead solder paste suitable for die and clip attach of high reliability power packages. Fulfills demanding voids and cleanliness requirements. Excels in automated high-volume production. Spacers option available for bondline and fillet height control. Minimize die tilt.
- Compatible to DA5118 D (Dispensing)
- Exceptional print-to-print consistency
- Wide operating window
- Superior wetting with low flux residue
- Achieves low void rate with low peak reflow temperature (350-370 ⁰C)
- Excellent cleanability
Applications include:
Power Discretes consisting of
- MOSFET
- Power Transistor
- Power Diodes
- Power Rectifiers
