Solder Pastes and Fluxes for Advanced Packaging
Welco ultra-fine pitch solder pastes & AP fluxes
Enables miniaturization of solder joints in state-of-the-art semiconductor packages- SiPs, PoPs, 2.5D/3D packages, flip chips
Enables maximum yield with zero defects, thermal warpage control and high reliability performance
Welco paste contains state-of-the art Welco powders- perfectly spherical, smooth surface, narrow particle size distribution
Excellent paste performance: consistent paste printing release down to 55um stencil opening (T7); no splashing, minimal void after multiple reflows; long stencil life and staging life
Pioneers carbon reduction with Welco 100% recycled tin pastes
Water Soluble Ultra-Fine Pitch Printing Paste
Welco™ AP520 and AP5112 series in Type 6 & Type 7 and Type 8+
- State-of-the art Welco powders- perfectly spherical, smooth surface, narrow particle size distribution
- Consistent paste release down to 60um stencil openings, minimal void after multiple reflows
- Excellent paste performance- no splashing, minimal void, long stencil life and staging life
- Enables all-in-one printing for passive components and flip chips in a single step
- In mass production for years for SiP applications such as 5G RF Front End modules, wife/bluetooth modules, smart wearables
- Available in SAC305, ULA SAC305, 100% recycled tin SAC305 and other alloys
Low Temperature Fine Pitch Printing Paste
Welco™ AP519 T6 no clean printing paste
- Low peak reflow temperature down to 170°C which minimizes warpage and prevents solder-remelt
- Targeting multi-side SiPs, PoPs or other applications that require multiple reflows at low temperature
- Excellent paste release down to 150um pitch, minimal defects such as void or beading
- In mass production for popular consumer applications
Flux for Fine-Pitch Flip Chip Attach
AP500X water soluble flux
- Suitable for ultra-fine pitch flip chip attach- high performance computing, memory, mobile, etc.
- Zero defects - no cold joint or solder creeping, low void
- Excellent flux residue cleanability (deflux) by DI water or with aqueous surfactant
- Also suitable for bumping/BGA attach application, effectively removing CuOSP layer during reflow
Applications include:
- 5G RF Front End (RFFE) module SiP, used in all mainstream 5G smartphones
- Wifi/bluetooth SiP modules of mobile and smart wearables
- Camera modules
- SiP modules for laptops and tablets
- High-performance computing /AI applications, such as GPUs, mobile processors, HBM
- Automotive ADAS modules
