Solder Pastes

Heraeus Electronics offers a wide range of solder pastes from no-clean to water soluble pastes ranging from type 3 to type 8 and beyond, with alloy types including but not limited to SAC305, ULA SAC305, high-reliability alloys, and low-temperature alloys. Alloy options are available with 100% recycled tin for significant carbon reduction.

Surface Mount Technology (SMT) Solder Paste

• Wide Range of no-clean, halogen-zero products

• Innolot® & HT1 for higher reliability assemblies

• Type 3, 4 and 5 versions

Power Electronic Module Die Attach Solder Pastes

• Outstanding low-voids performance

• Minimal solder splashing

• Low tilt and rotation of dies

Die Attach Paste for Power Discrete  

• Multiple lead-containing, high-melting point alloys suiting to different device needs

• Halogen zero and halogen-free formulation

• Long worklife suitable for high-volume production environment

Advanced Packaging Solder Pastes and Fluxes

• Welco fine-pitch (T5, T6, T7 and beyond) printing solder pastes

• Fluxes for flip chip attach and BGA attach

• Also available in 100% recycled tin version complying with RMI and ISO14021

Mini LED Solder Pastes and Fluxes

• Welco fine-pitch (T5, T6, T7 and beyond) printing solder pastes

• High-tackiness flux for miniLED attach