mAgic® and magiCu® Pressure Sinter Pastes for Power Electronics

  • Pressure sintering increases the device reliability up to 10 times compared to solder

  • High thermal conductivity for longer lifetime >200W/mK

  • Enables high operating temperature >175°C

  • Lead-free and halogen zero formulation for environmental compliance

  • No flux residue, no cleaning required

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mAgic® PE338: Silver Pressure Sinter Paste for Power Electronics Applications

The mAgic® PE338 Series by Heraeus offers a high-performance Ag sinter paste designed to meet the demanding requirements of power electronics applications. With its exceptional electrical and thermal properties, mAgic® PE338 provides increased lifetime, low thermal resistance, and elevated operation temperatures, making it suitable for various sectors like automotive, industrial, renewable energy, and aerospace.

  • High thermal conductivity for longer lifetime
  • High electrical conductivity improves device efficiency
  • Enables high operating temperature
  • Sintering on bare copper
  • Consistent printing performance
  • Workable for stencil printing, screen printing and jetting

magiCu® PE401: Copper Pressure Sinter Paste for Power Electronics Applications

magiCu® PE401 is an innovative pressure-assist material suitable for die-attach application of high power packages. This paste is a cost effective Ag-free sinter paste that forms a highly reliable joint with excellent thermal conductivity. It is therefore a perfect solution towards lifetime increase and efficiency improvement of power electronic devices in e-mobility and other high power applications.

magiCu® PE401 allows both wet and dry placement process and is fully compatible with the standard production equipment in the market.

  • Improves device reliability
  • Wet placement process ready
  • Sintering on bare copper
  • Formic acid free process
  • Nano-particle free

mAgic® PE360: Silver Pressure Sinter Paste for Module Attach

mAgic® PE360 is designed to enter a new era in power electronics packages with enabling module attach sintering in almost any size.

mAgic® PE360 has an improved drying behaviour and reduced sintering parameters to tackle the key challenges in module attach sintering. Therefore, this paste maximizes efficiency and reliability and ensures the demanding requirements for future power modules.

  • Enables maximum system performance
  • High thermal conductivity and excellent reliability
  • Low sintering parameters to protect sensitive power modules
  • Workable for printing and slit nozzle dispensing application
  • Wet placement process ready

Pressure Sinter Applications include: 

  • Traction inverter for EVs

  • Power Electronincs for New Energy and Industrial Applications