mAgic® and magiCu® Pressure Sinter Pastes for Power Electronics
Pressure sintering increases the device reliability up to 10 times compared to solder
High thermal conductivity for longer lifetime >200W/mK
Enables high operating temperature >175°C
Lead-free and halogen zero formulation for environmental compliance
No flux residue, no cleaning required
The mAgic® PE338 Series by Heraeus offers a high-performance Ag sinter paste designed to meet the demanding requirements of power electronics applications. With its exceptional electrical and thermal properties, mAgic® PE338 provides increased lifetime, low thermal resistance, and elevated operation temperatures, making it suitable for various sectors like automotive, industrial, renewable energy, and aerospace.
magiCu® PE401 is an innovative pressure-assist material suitable for die-attach application of high power packages. This paste is a cost effective Ag-free sinter paste that forms a highly reliable joint with excellent thermal conductivity. It is therefore a perfect solution towards lifetime increase and efficiency improvement of power electronic devices in e-mobility and other high power applications.
magiCu® PE401 allows both wet and dry placement process and is fully compatible with the standard production equipment in the market.
mAgic® PE360 is designed to enter a new era in power electronics packages with enabling module attach sintering in almost any size.
mAgic® PE360 has an improved drying behaviour and reduced sintering parameters to tackle the key challenges in module attach sintering. Therefore, this paste maximizes efficiency and reliability and ensures the demanding requirements for future power modules.
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