mAgic® Sinter Pastes for High Performance Applications

Higher power densities come along with a higher operation temperature. At the same time, devices must last longer. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device up to 10 times.

Silver sintering technology is suited for high operation temperatures due to its pure Ag or Cu die attach layer. They also provide excellent thermal conductivity and at the same time a longer lifetime compared to solder.

The Heraeus Electronics mAgic® series sinter material is suitable for power applications on substrates, baseplates or heatsinks (pressure sintering) as well as for lead frame packages (non-pressure sintering).

The special series for die attach pressure sintering mAgic® PE338 (formerly ASP338) show an increased lifetime up to 10 times more compared to conventional solder in power cycling. As well, it requires low process pressure compared to other sintering materials. For module attach applications the new mAgic® PE360 enables the maximum performance from the system.

For non-pressure sintering applications, sinter mAgic® DA295 (formerly ASP295) series is a lead-free substitute for high melting point solders. The products are available for usage in semiconductor applications. These come as print or dispense version and offer high thermal conductivity for lead frame and LED packages.

magiCu® Sinter Pastes for cost efficiency and highly reliable packages

magiCu® sinter pastes are developed to tackle the challenges of silver sintering and offer a cost-efficient solution in those applications which are suitable for Ag free sintering materials.

The first magiCu® product which Heraeus proudly presented is the magiCu® PE401 pressure sinter paste for die attach applications in power modules. The outstanding thermal and electrical performance compared to traditional soldering in addition to the competitive total cost of ownership offers an attractive package for many different applications.

Use the Heraeus Electronics experience to find the best solution for your die attach application.

Benefits:

• Up to 10 times higher lifetime compared to solder paste
• Applicable from extremely low to high temperature range (-55 to 250°C) due to the solid silver layer
• Pure Ag or Cu interconnect for operation temperatures up to 250°C
• Enables increased power density (system cost reduction) at a total cost level comparable to solder process
• Typical thermal conductivity of 150 W/mK and above
• Zero-halogen formulation
• Fewer process steps due to no flux cleaning, no splattering
• Designed for use in automatic processing with industrial equipment
• Wide process window:
  • stencil life time >8h
  • both pressure and non pressure sintering available
  • variable process temperatures of 200 – 250°C