Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4) Active Metal Brazed (AMB) Substrates
High thermal conductivity
Outstanding bending strength
Excellent fracture toughness
Low coefficient of thermal expansion (CTE)
Cost-efficient, silver-free (Ag-free) active metal brazed substrate solution (Condura®.ultra)
High thermal conductivity and mechanical robustness for demanding applications
Our Si3N4 AMB (Active Metal Brazed) substrates, including Condura®.prime and Condura®.ultra, offer high heat dissipation and increased module lifetime. These substrates stand out due to their low thermal resistance and high mechanical robustness. Specifically designed for applications demanding high thermal conductivity and durability, our products extend this robust framework to a wide range of applications.
Heraeus Condura®.prime and Condura®.ultra substrates are suited for the most demanding applications and particularly for power electronics modules with high power density. They fulfill the highest requirements on thermal performance and reliability.
Applications include:
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Traction inverters in electric vehicles
- DC DC converters in electric vehicles
- Onboard chargers in electric vehicles
Quick Facts
Ceramic thickness: 0.25 mm / 0.32 mm
Copper thickness: 0.30 mm / 0.50 mm / 0.80 mm
Surface finish: bare Cu, Ni, NiAu, full or partial Ag
Delivery as single unit or master card
Discover more about our cutting-edge AMB technology and substrates and explore how the Heraeus Condura® series can enhance your applications.
