Condura® - Metal Ceramic Substrates for Power Electronics
Heraeus Electronics offers a comprehensive portfolio of Metal Ceramic Substrates, addressing the diverse needs of the power electronics market, from low-power applications to the most demanding industries.
The Condura® portfolio includes Aluminium oxide (Al2O3) Direct Copper Bonded (DCB) Substrates (Condura®.classic and Condura®.extra), and Silicon nitride (Si3N4) Active Metal Brazed (AMB) Substrates (Condura®.prime and Condura®.ultra).
Metal ceramic substrates serve as crucial components in power electronic modules. They attach and connect multiple semiconductor devices such as SiC MOSFETs, Si IGBTs, and Si diodes. The ceramic substrate acts as an insulating layer while the copper metallization ensures excellent electrical and thermal conductivity. Their outstanding thermal and mechanical properties are crucial for efficiently dissipating heat from semiconductor devices, ensuring reliable module operation under thermal cycling conditions.
Discover more about our Condura® metal ceramic substrates and see how they can improve your applications in industrial, automotive, and new energy sectors.
