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  4. Direct Copper Bonded (DCB) Aluminiumoxid (Al2O3) Substrate

Condura®.classic and Condura®.extra – Standard and Zirconia-toughened Al2O3 DCB Substrates

  • Good thermal and mechanical properties 

  • Low coefficient of thermal expansion (CTE)

  • Zirconia-toughened (ZTA) DCB Substrates (Condura®.extra) combine higher bending strength with comparable thermal conductivity to Al2O3 DCB Substrates 

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The Direct Copper Bonding (DCB) substrate, also known as DBC, has been a long-proven standard for power electronic modules across industrial, home appliances, and renewable energy applications.  

Under the Condura® .extra brand, Heraeus Electronics offers zirconia-toughened substrate solutions that not only provide excellent mechanical properties but also exhibit enhanced thermal properties, making them suitable for challenging environments. The Condura®.classic and Condura®.extra versions cater to diverse applications. 

Our Condura®.classic and Condura®. extra substrates have an excellent performance/cost efficiency ratio. They are an excellent choice for most of the industrial and renewable energy applications.

 

These applications include for example: 

  • Motor drives for electric motors

  • Factory automation/robotics applications
  • Elevators
  • Fork lifts
  • Air Conditioning, compressors, water pumps
  • Solar inverters
  • Wind turbines

 

Quick Facts

Ceramic thickness: 0.25 mm / 0.32 mm / 0.38 mm / 0.63 mm
Copper thickness: 0.20 mm / 0.25 mm / 0.30 mm / 0.40 mm
Surface finish: bare Cu, Ni, Ni/Au
Delivery as single unit or master card

Learn more about how the Heraeus Electronics Condura® series can meet your technical and operational requirements in demanding applications.