Die Top System (DTS®)
Up to over 50% increased die current capability and up to over 50 times longer lifespan
Enables junction temperatures of over 200°C, reducing power derating
Customizable configurations for optimal performance and reliability
Accelerated development processes and technical innovation
Collaborative partnerships, including collaboration with Danfoss BondBuffer® technology
Heraeus Electronics Die Top System (DTS®) - Get the Most out of your Power Module
Unlock next-level performance in power module lifetime and power density with Heraeus Electronics Die Top System (DTS®), your key to freedom from the constraints of conventional die interconnection. Transition to DTS® and embrace the extraordinary boost in durability and efficiency for your high-power applications.
Main Features of Heraeus Electronics Die Top System (DTS®)
Heraeus Electronics DTS® stands out by offering major advancements in reliability and current carrying capabilities:
- Enhanced Performance: Over 50% increase in die current capability and a lifetime more than 50x longer compared to solder die attach and aluminum wire bonding.
- Higher Junction Temperatures: Capable of exceeding 200°C, enabling less power derating and potential chip size reduction.
- Maximized Cost-Efficiency: Significant decrease in cost per ampere, optimizing both performance and profitability.
- Technical Excellence & Customization
- Recognizing the need for precision and customization, Heraeus Electronics DTS® brings high technical expertise with tailored configurations to your specific requirements:
- Bond Substrate Options: Variety of core materials like Cu and Cu-Alloys with functional surfaces such as Ag, Au, or Pd. Thickness ranging from 30 - 500µm, thermal conductivity at 180 – 390 W/mK, and tensile strength from 200 - 650 N/mm2.
- Pre-Applied Ag-Sinter Layer: Designed for optimal sintering with a recommended pressure range of 10-30 MPa and temperature range of 230 - 280°C.
- Thermal conductivity excels at >150 W/mK, and no cleaning process is required.
Tailored for Excellence
Our team supports you in finding the optimal configurations for your design, and our facility is well-equipped to test and perfect the match between all materials within the DTS to maximize both system performance and reliability.
Partner with Heraeus Electronics:
By choosing Heraeus, you gain a partner with the capability to accelerate and refine your development process. Benefit from our vast experience and innovation, and rest assured that confidentiality and intellectual property rights are maintained, as outlined in our Declaration to Customers.
Heraeus Electronics collaborates strategically with Danfoss to incorporate Danfoss BondBuffer® technology under specific Heraeus Electronics and Danfoss IP rights, fostering advancements in the industry and providing you with cutting-edge solutions.
The Die Top System enables wide band gap semiconductors and future high temperature applications:
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Automotive - Power train H(EV)
- Wind
- Traction
- Power conversion
