Copper Power Bonding Ribbons
-copper.jpg "Heraeus Electronics Thick Ribbons (>75µm) Copper")
Excellent bondability due to extreme softness and minimal deformation resistance
Consistently fine grain structure
Exceptional thermal stability
Minimal electrical resistivity
Wide bonding process window
Enhanced productivity with special Heraeus Electronics spools for extended lengths
Potential for UPH improvement by upgrading wires to ribbons
High reliability in long-life and reliability tests, along with compliance with legal requirements including REACH and RoHS
Copper, as an interconnect material, offers excellent electrical conductivity and fusing current values. The PowerCu Soft Wires and Ribbons provide outstanding long-term reliability and robust bonds, addressing challenges in thermal management, robustness, miniaturization, weight reduction, and enhanced reliability, particularly for high-voltage modules and systems. Our unique focus on thick bonding wires, alongside other power electronics products, simplifies and optimizes production processes for efficient and cost-effective manufacturing.
Applications include:
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Engine and transmission control systems
- Power electronics for electric and hybrid vehicle drivetrains
- Generator control
- SiC technology for reducing electric power losses
- GaN-based electronics
- State-of-the-art IGBT modules for drives and power supplies
- Inverters for renewable energy sources
- Transportation systems
-aluminium.jpg "Heraeus Electonics Thick Ribbons (>75µm) Aluminium")
