Silver Bonding Wires
Silver wires offer significant material cost savings compared to gold bonding wires
Exact configuration to application needs: Good reflectivity for LED devices
Usable for pad sensitive devices, enabled by the soft FAB
MTBA and UPH as good as gold wire
Good bondability with both N2 and forming gas
Applicable in highest processing speeds
Advanced reliability for both IC and LED packaging
AgUltra-HR® bonding wires designed to withstand extended reliability test intervals in temperature cycling as well as high temperature storage conditions and HAST
Silver bonding wires have been developed as a perfect combination of significant cost reduction compared to gold and required bonding features for sensitive devices. They achieve good reliability and excellent bondability. With a diameter down to a size of 0.6 mils / 15 microns they are suitable for fine structures with an ultra-fine pitch.
Applications include:
-
Computer:
- PC
- Tablets
- Servers & systems
- Consumer Electronics:
- Smartphones & phones
- TVs
- Imaging devices
- Wearable electronics
- LED
- Communication:
- Wireless
- Wired
- Satellite
- NFC
-aluminium.jpg "Heraeus Electronics Fine Wires (<75µm) Aluminium")
