Small-Diameter Aluminium Wedge Bonding Wire
-aluminium.jpg "Heraeus Electronics Fine Wires (<75µm) Aluminium")
Excellent electrical and thermal conductivity
Relatively high fusing current developed for chip-on-board (COB) applications
Excellent bondability due to homogeneous chemical composition, stable mechanical properties, and smooth and clean wire surfaces
Highly reliable aluminium bonding wire for fine-pitch applications, compatible with aluminum package metallization
Room-temperature bonding at low energy levels, preventing damage to sensitive devices while ensuring high-integrity bonds
Three hardness grades to choose from
Aluminium bonding wire is available in many different configurations for a wide range of wedge bonding applications.
The small-diameter aluminum wedge bonding wire available from Heraeus Electronics is made of high-quality AlSi alloy and goes by the brand name of AlSi. Its principal applications are in motor vehicles, consumer electronics, and computers.
In contrast to heavy aluminum wire, which is used to carry power, fine aluminum bonding wire is dedicated to signal transmission and processing. It is commonly used as a Chip-On-Board (COB) application wire. AlSi aluminum-alloy wires offer compatibility with the aluminum on IC bonding pads, especially in fine-pitch applications. Aluminium bonding wires can be easily and cost-effectively bonded at room temperature and are thus ideal for forming high-integrity bonds and preventing damage to sensitive devices. The electrical and thermal conductivity properties of AlSi aluminium bonding wires are also excellent for a wide range of uses.
Applications include:
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Computer
- PC
- Tablets
- Servers & systems
- Consumer Electronics:
- Smartphones & phones
- TVs
- Imaging devices
- Wearable electronic
- Automotive:
- Infotainment
- Security
- Communications:
- Wireless
- Wired
