Fine Ribbons
Wide range of types available to suit your specific application requirements
Diverse packaging options for spooling to enhance productivity
High precision in dimensions
Consistent chemical composition throughout
Clean and smooth surface finishes
Efficient heat dissipation
High reliability demonstrated through endurance and dependability tests
Custom manufacturing according to your specifications
Ribbon bonding is a common interconnect method for microwave and RF MCMs, providing good heat dissipation and low impedance. Heraeus Electronics produces fine ribbons of various metals, customizable to precise specifications. Gold bonding ribbon is particularly suited for high-reliability applications, while our ribbons exhibit uniform width and can be plated with other metals. With controlled purity and additives, Heraeus Electronics Fine Bonding Ribbons have a homogeneous composition, stable mechanical properties, and clean surfaces, addressing thermal management, miniaturization, and weight reduction challenges.
Our thin ribbons are versatile solutions designed for high-performance applications. These ribbons deliver precise power transmission and excellent heat dissipation properties. With a focus on reliability and efficiency, thin ribbons are well-suited for industries such as electronics, telecommunications, and automotive. Trust Heraeus Electronics for exceptional thin ribbon solutions that meet your exact requirements.
Applications include:
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Mobile communications
- Television
- Microwave and high-frequency devices
- Optoelectronics
- Radar technology
- Antennas
- Aviation
- Military
