SMT Adhesives with High-Green Strength for High-Speed Production Processes
High-green strength for perfect fixation in high-speed production processes during curing and soldering process steps
Excellent adhesion with standard as well as with difficult-to-glue components
One-component, thermo-setting, solvent-free adhesive
High Surface Insulation Resistance (SIR)
Halogen-free series available
Advanced One-Component Adhesive for a Wide Range of Applications
The Surface-Mount Technology (SMT) adhesives portfolio at Heraeus Electronics offers outstanding properties during the process as well as after soldering, ideal for high-speed processes.
During the fast placement process in Surface-Mount Technology, our adhesives with high-green strength are critical to prevent the displacement of components until they are fully soldered.
Heraeus Electronics' SMT adhesives, which are one-component, thermo-setting, solvent-free adhesives, provide excellent adhesion across a variety of components, even those considered difficult to glue. Our adhesives are designed for maximum throughput and low cost of ownership, adaptable to all common application methods including printing, dispensing, pin transfer, and jetting.
Discover more about our advanced SMT adhesive solutions and how they can enhance your manufacturing efficiency.
Applications include:
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Engine management (ECU)
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Transmission controllers
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Braking (ABS)
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Steering and stability systems (ABS, ESP)
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Smartphones and tablets
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Imaging devices
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Servers and systems
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Camera module
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LED
| Product Name | Application Method | Curing Temperature | Color | Application | Downloads |
|---|---|---|---|---|---|
| PD955PY | Printing | 3 min / 125 °C (Standard Curing) | Yellow | Attachment of SMT components onto PCBs and for use on bare substrates with high green strength | Technical Data Sheet PD955Y |
| PD955PRM | Printing | 3 min / 125 °C (Standard Curing) | Pink | Attachment of SMT components onto PCBs and for use on bare substrates with high green strength | Technical Data Sheet PD955PRM |
| PD955M | Dispensing | 3 min / 125 °C (Standard Curing) | Red | Attachment of SMT components onto PCBs and for use on bare substrates with high adhesion on difficult to glue components | Technical Data Sheet PD955M |
| PD205A-Jet | Jetting | 3 min / 125 °C (Standard Curing) | Red | Attachment of SMT components onto PCBs and for use on bare substrates for jetting applications | Technical Data Sheet PD205A-Jet |
