Conductive Adhesives for Demanding Applications
Excellent electrical and thermal performance
One component ready-to-use solution for simple and stable processing
High-reliability solution due to excellent thermo-cycling performance
Solvent-free and lead-free adhesives
Low temperature curing series
One-Component Epoxy Adhesives Meeting Industry Challenges
Heraeus Electronics offers a one-component, thermo-setting, epoxy adhesive with excellent properties to meet industry challenges in diverse sectors.
Our solvent-free and lead-free conductive adhesives enable a simple and stable manufacturing process and are available for dispensing and printing applications.
It delivers excellent conductivity at high reliability, making it ideal for automotive, medical and consumer electronics applications.
Learn more about our specialized adhesive solutions to see how they can enhance your manufacturing processes.
Applications include:
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Engine management (ECU)
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Transmission controllers
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Braking (ABS)
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Steering and stability systems (ABS, ESP)
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Glucose Monitoring Device
| Product Name | Application Method | Curing Temperature | Application | Downloads |
|---|---|---|---|---|
| PC3000 | Screen Print | 10 min / 150 °C or 20 min / 120 °C (Standard Curing) |
Hybrid circuit attachment of dies, SMT / SMD component on LTCC / ceramic for automotive applications. | Technical Data Sheet PC3000 |
| PC3001 | Dispense | 10 min / 150 °C or 20 min / 120 °C (Standard Curing) |
Hybrid circuit attachment of dies, SMT / SMD component on LTCC / ceramic for automotive applications. | Technical Data Sheet PC3001 |
| PC3002 | Stencil Print | 10 min / 150 °C or 20 min / 120 °C (Standard Curing) |
Hybrid circuit attachment of dies, SMT / SMD component on LTCC / ceramic for automotive applications. | Technical Data Sheet PC3002 |
| PC3601 | Dispense | 3 min / 90 °C or 5 min / 80 °C (Low Temperature Curing) |
Die & passive component attach on PCB for automotive applications (also components) camera modules. | Technical Data Sheet PC3601 |
