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Press release
09/30/2024

Heraeus Electronics Wins 2024 Mexico Technology Award for Innovative Sinter Paste

Technology & Innovation
Business

Hanau, Germany – 30. September 2024 – Heraeus Electronics (“Heraeus”), a leader in electronic materials solutions, is proud to announce that its innovative product, magiCu® PE401 Cu Sinter Paste, has been honored with the 2024 Mexico Technology Award in the category of 'Sinter Paste'. The award was presented at a ceremony on September 11, 2024, before the commencement of SMTA Guadalajara, hosted by Mexico EMS, the premier Spanish-language publication in the electronics manufacturing industry.

The magiCu® PE401 Cu Sinter Paste is distinguished by its innovative copper-based, silver-free (Ag-free) formulation, designed to address the critical needs of power electronic device manufacturing. This cutting-edge material not only enhances production efficiency through its fast-sintering process but also significantly reduces manufacturing costs by providing a high-performance alternative to traditional silver sintering pastes.

"We are thrilled to receive this award, which recognizes our commitment to developing advanced materials that meet the evolving needs of the electronics industry," said David Malanga, Director of Marketing and Sales Americas at Heraeus Electronics. "The magiCu® PE401 represents an important step in our pursuit of cost-effective and advanced solutions, offering our clients a competitive edge in high-reliability applications."

The magiCu® PE401 Cu Sinter Paste sets new standards in the industry by offering exceptional thermal conductivity and reduced cycle times. Its ease of use and integration into existing manufacturing lines ensures that it is not only a sustainable choice but also accessible for electronics manufacturers aiming to enhance their production capabilities. It is a perfect solution towards lifetime increase and efficiency improvement of power electronic devices in e-mobility and other high-power applications.

Anja ZieglerHead of Marketing and Communications
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