- Paste Type: Conductor
- Application Method: Screen Printing
Dipping
- Substrate: Alumina (Al2O3)
- Metal: AgPtPd
- Application: Hybrid IC
Component Applications
- Description: C4081 is a Ag/Pd/Pt thick film conductor formulation which provides outstanding leach resistance and aged adhesion with many types of solder. This material has excellent silver migration resistance.
- Key features: Excellent Ag migration resistance
Outstanding leach resistance
- Process Temperature: 850°C peak temperature
Dwell time of 9-11 minutes
- Film Thickness : 7 10 ?m
- Conductivity: ? 187 milliohms per square
at 8.5 microns fired film thickness
- Solids: 72.6 ±1%
