- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Aluminum Nitride
- Metal: AgPd
- Application: Hybrid IC
- Description: C2330 is a silver/palladium (3:1) high solids conductor paste designed for hybrid applications utilizing aluminium nitride. It exhibits good solderability and excellent adhesion.
- Key features: Excellent solderability
Excellent adhesion to aluminum nitride
- Process Temperature: 850 °C peak temperature. Dwell time for 10 minutes.
- Film Thickness : 13-16 um
- Viscosity: 150-220 Pa-s, Brookfield HBT, DVIII SC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
- Conductivity: 30-40 milliohms/square at 15 um fired film thickness
- Solids: 83.0 ± 1.0 %
- Alloy Ratio: 03:01
