- Paste Type: Conductor
- Application Method:
Stencil Printing
- Substrate: Alumina
- Metal: AgPd
- Application: FLS/Potentiometers
- Description: C 2290P is a screen or stencil printable, silver palladium 9:1 paste designed as a hole plug in alumina substrates. The high solids loading allows excellent filling properties. C 2290P has low shrinkage, which allows a complete fill of the through hole.
- Key features: High solids loading#Low shrinkage#For use in a print process
- Process Temperature: Fire at 850 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30-60 minutes.
- Viscosity: 15-25 Pas
(25 °C, D = 100/s)
- Conductivity: ≤ 7-15 milliohms/square at 40um fired film thickness
- Solids: 91.0 ± 1.0 %
- Alloy Ratio: 09:01
