C2129A

Description

C2129A is a high performance mixed bonded Ag/Pd conductor material. It offers cost savings over standard Ag/Pd formulations while maintaining the advantages of leach resistance and aged adhesion. C2129A is also aluminum wire bondable. C2129A is supplied with a rheology, which results in a dense, uniform fired film.

Key Features

Low cost Excellent solderability and leach resistance Low resistivity Good Al wire bond adhesion (initial and aged)

Metal

AgPd

Viscosity

120 – 180 Kcps Brookfield HBTSC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C

Coverage

85 cm²/g at 12 μm fired film thickness

Coverage

85 cm²/g at 12 μm fired film thickness

Storage and Paste Preparation

Store in a dry condition at 5 – 25 °C,

Warranty

6 months

Printing Parameters

280 – 325 mesh stainless steel screen 0.5 mil emulsion 1.1 mil wire

Drying Temperature

150 °C for 10 minutes

Process Temperature (TDS)

850 °C peak temperature Dwell time at peak temperature for 10 minutes

Film Thickness

Wet: 30 – 36 µm Dried: 22 – 27 µm Fired: 10 – 15 µm