- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina (Al2O3)
- Metal: AgPd
- Application: Hybrid IC
- Description: C2129A is a high performance mixed bonded Ag/Pd conductor material. It offers cost savings over standard Ag/Pd formulations while maintaining the advantages of leach resistance and aged adhesion. C2129A is also aluminum wire bondable. C2129A is supplied with a rheology, which results in a dense, uniform fired film.
- Key features: Low cost
Excellent solderability and leach resistance
Low resistivity
Good Al wire bond adhesion (initial and aged)
- Printing Parameters: 280 – 325 mesh stainless steel screen
0.5 mil emulsion
1.1 mil wire
- Process Temperature: 850 °C peak temperature Dwell time at peak temperature for 10 minutes
- Film Thickness : Wet: 30 – 36 µm
Dried: 22 – 27 µm
Fired: 10 – 15 µm
- Viscosity: 120 – 180 Kcps Brookfield HBTSC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C
- Conductivity: ≤ 6.0 milliohms/square at 12 um fired film thickness
- Solids: 80.0 ± 1.0 %
- Alloy Ratio: 30 : 1
- Resistivity (Ohm/sq.): ≤ 6.0 mΩ/ at 12 μm fired film thickness