- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: AgPd
- Application: Hybrid IC
- Description: C2105 is a 20:1 AgPd composition designed for hybrid applications and application where leach resistance is required. The C2105 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial applications where common requirement exist. It exhibits good solderability and aged adhesion properties.
- Key features: Good solderability
Excellent long-term adhesion
Good leach resistance
- Process Temperature: 850 °C peak temperature10 minutes at peakTotal cycle time 30 – 60 minutes.
- Film Thickness : 9 – 15 μm
- Viscosity: 150 – 220 Kcps Brookfield HBTSC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C
- Conductivity: ≤ 8 milliohms/square at 12 um fired film thickness
- Solids: 79.0% ± 1.5 %
- Alloy Ratio: 20 : 1
- Resistivity (Ohm/sq.): ≤ 8 mΩ/ at 12 μm fired film thickness