- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: AgPt
- Application: Hybrid IC
- Description: C1076SD (LPA609-022) is a low-cost Ag/Pt conductormaterial that utilizes an oxide bond system for providing particularly excellent adhesion to alumina and beryllium oxide substrates. The material can easily be used to print fine line patterns or large-area ground planes and features all the advantages of a fritless system. Resulting film is dense and uniform.
- Key features: Excellent solderability and leach resistance#Solderable on alumina Compatible with HERAEUS resistors#Excellent initial and aged adhesion#Inner layer for multilayer applications#Very good conductivity#Aluminum and gold wire bondable
- Printing Parameters: Print through a 200-325 mesh stainless steel screen. Total thickness: 50-110 um.
- Process Temperature: Fire at 850 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30-60 minutes.
- Film Thickness : 12.5-15.5 um
- Viscosity: 30-50 Pas (25 °C, D = 100/s)
- Conductivity: ≤ 40.0 milliohms/square (FFT: 12 um)
- Solids: 82.0 % ± 1.5 %
- Alloy Ratio: 99:01:00
